MTA18ASF2G72AZ-2G6E2 - 16 GB - 1 x 16 GB - DDR4 - 2666 MHz - 288-pin DIMM
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> DDR4 functionality and operations supported as defined in the component data sheet
> 288-pin, unbuffered dual in-line memory module (UDIMM)
> Fast data transfer rates: PC4-3200, PC4-2666, or PC4-2400
> 16GB (2 Gig x 72)
> V DD = 1.20V (NOM)
> V PP = 2.5V (NOM)
> V DDSPD = 2.5V (NOM)
> Supports ECC error detection and correction
> Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
> Low-power auto self refresh (LPASR)
> Data bus inversion (DBI) for data bus
> On-die V REFDQ generation and calibration
> Dual-rank
> On-board I 2 C temperature sensor with integrated serial presence-detect (SPD) EEPROM
> 4 internal device bank groups with 4 banks per group produce 16 device banks
> Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
> Selectable BC4 or BL8 on-the-fly (OTF)
> Gold edge contacts
> Halogen-free
> Fly-by topology
> Terminated control, command, and address bus
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![Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better. CAS latency](https://gfx.senetic.com/gfx/help_new.png)
![A computer's memory which is directly accessible to the CPU. Internal memory](https://gfx.senetic.com/gfx/help_new.png)
![How the overall memory of the product is put together, defined by the number of modules and the size. Memory layout (modules x size)](https://gfx.senetic.com/gfx/help_new.png)
![The type of internal memory such as RAM, GDDR5. Internal memory type](https://gfx.senetic.com/gfx/help_new.png)
![The frequency at which the memory (e.g. RAM) runs. Memory clock speed](https://gfx.senetic.com/gfx/help_new.png)
![What this product is used as a part of (component for). Component for](https://gfx.senetic.com/gfx/help_new.png)
![Design of the memory e.g. 240-pin DIMM, SO-DIMM. Memory form factor](https://gfx.senetic.com/gfx/help_new.png)
![ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention. ECC](https://gfx.senetic.com/gfx/help_new.png)
![The voltage (V) of the memory in the device. Memory voltage](https://gfx.senetic.com/gfx/help_new.png)
![The minimum and maximum temperatures at which the product can be safely operated. Operating temperature (T-T)](https://gfx.senetic.com/gfx/help_new.png)
![The measurement or extent of something from side to side. Width](https://gfx.senetic.com/gfx/help_new.png)
![The distance from the front to the back of something. Depth](https://gfx.senetic.com/gfx/help_new.png)
![The measurement of the product from head to foot or from base to top. Height](https://gfx.senetic.com/gfx/help_new.png)